UL cUL 2layer Black Motherboard for LED Lights
China UL cUL 2layer Black Motherboard for LED Lights, Find details about China PCB, Motherboard from UL cUL 2layer Black Motherboard for LED Lights
Basic Info.
Model NO.
led light pcb
Condition
Used
Mini Hole
0.2mm
Mini Width/Space
6/6mil
Board Thickness
1.6mm
Soldermask
Black
Silkscreen
White
Finish
HASL Lead Free
Copper
1oz
Trademark
Coenrichpcb
Transport Package
Vacumme
Specification
117mm x 117mm
Origin
Made in China
HS Code
8534001000
Model NO.
led light pcb
Condition
Used
Mini Hole
0.2mm
Mini Width/Space
6/6mil
Board Thickness
1.6mm
Soldermask
Black
Silkscreen
White
Finish
HASL Lead Free
Copper
1oz
Trademark
Coenrichpcb
Transport Package
Vacumme
Specification
117mm x 117mm
Origin
Made in China
HS Code
8534001000
Product Desciption
Quality Policy
transcendent quality,perfect embodiment,Prevent pollution,Energy efficiency,Green production,Continual improvement,customers' satisfaction.
Quality Target:
Non Automobile products:
Rate of the first passed products:>95%
Rate of delivery on time:>98%
Rate of customer's complaint:<1%
Automobile products:
Rate of the first passed products :100%
Rate of customer's complaint::<0.5%
| Capability for Rigid PCB Production | ||
| NO. | ITEM | TECHNICAL DATA |
| 1 | Types of Products | Multilayer PCB, Buried/Blind Via PCB, High Frequency PCB, Rigid-Flexible PCB, Teflon Board, HDI, Aluminum Base PCB. |
| 2 | Materials | FR-4, Copper core, Getek , Rogers, Aluminum core, High TG, Teflon, Black FR4 |
| 3 | Layers | 2-32(layers) |
| 4 | Max Board Size | 450 x 660mm 18" x 26" |
| 5 | Min Board Thickness | 4(layers) 0.40mm 16mil |
| 6(layers) 0.80mm 32mil | ||
| 8(layers) 1.00mm 40mil | ||
| 10(layers) 1.20mm 48mil | ||
| 6 | Copper Clad(Max.) | 20oz(outer) / 4oz(inner) |
| 7 | Min line Width/space | 0.075mm 3mil |
| 8 | Drill Size Mechanical (min) | 0.20mm 8mil |
| 9 | Drill Size Laser(min) | 0.10mm 4mil |
| 10 | PTH Wall Thickness | 0.020mm 0.8mil |
| 11 | PTH dia tolerance | ±0.075mm ±3mil |
| 12 | NPTH hole dia tolerance | ±0.05mm ±2mil |
| 13 | Hole Position Deviation | ±0.05mm ±2mil |
| 14 | Outline Tolerance | ±0.10mm ±4mil |
| 15 | S/M Pitch | 0.08mm 3mil |
| 16 | Insulation Resistance | 1E+12Ω(Normal) |
| 17 | Test Voltage | 50~300V |
| 18 | Aspect ratio | 8:1 |
| 19 | Thermal Shock | 3x10Sec@288 ºC |
| 20 | Warp and Twist | ≤0.75% |
| 21 | Current breakdown | 10A |
| 22 | Electric Strength | >1.3KV/mm |
| 23 | Peel Strength | 1.4N/mm |
| 24 | Solder Mask Abrasion | ≥6H |
| 25 | Flammability | 94V-0 |
| 26 | Impedance Control | ±10% |
| 27 | Buried Via | Yes |
| 28 | Blind Via | Yes |
| 29 | HDI | 2+N+2 4mil Via hole |
| 30 | Surface Finished | ENIG, ImAg, ImSn, OSP, HASL Free |
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