Good Quality Red PCB Circuit in Electronics

China Good Quality Red PCB Circuit in Electronics, Find details about China PCB, Circuit Board from Good Quality Red PCB Circuit in Electronics

Model NO.
UC-65411
Base Material
Copper
Insulation Materials
Epoxy Resin
Model
PCB
Brand
Uc
Layer Count
2 Layer
Soldermask Color
Red
Base Material Type
Fr4
Material Finished Thickness
1.6mm
Finished Copper Thickness
35/35um
Surface Treatment
HASL Lead Free
Lead Time
5 Working Days
Ipc Standards
Ipc Class II
Trademark
UC
Transport Package
Vacuum Package
Specification
UL(US&Canada). ISO9001. RoHs, TS, SGS
Origin
China
HS Code
85340090
Model NO.
UC-65411
Base Material
Copper
Insulation Materials
Epoxy Resin
Model
PCB
Brand
Uc
Layer Count
2 Layer
Soldermask Color
Red
Base Material Type
Fr4
Material Finished Thickness
1.6mm
Finished Copper Thickness
35/35um
Surface Treatment
HASL Lead Free
Lead Time
5 Working Days
Ipc Standards
Ipc Class II
Trademark
UC
Transport Package
Vacuum Package
Specification
UL(US&Canada). ISO9001. RoHs, TS, SGS
Origin
China
HS Code
85340090

Ucreate is specialized in low to medium volume high quality PCB population with UL&ISO&RoHs certificate approved.
 
Our Specialities: 
1. No MOQ
2. Quick Lead time
3. High standard pcb depends on IPC Class II or IPC Class III if required
4. 100% E-tested guarantee before shipping
5. RoHS, UL, ISO, SGS certificate approved
 
Our capabilities:
 
ItemsSpeci.
Max panel size32" x 20.5"(800mm x 520mm)
Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)5 mil(0.13mm)
Min thickness(inner layer)4 mil(0.1mm)
Inner copper thickness1~4 oz
Outer copper thickness0.5~6 oz
Finished board thickness0.4-3.2 mm

Board thickness tolerance control
±0.10 mm±0.10 mm
±10%±10%
±10%±10%
Inner layer treatmentbrown oxidation
Layer count Capability1-30 LAYER
alignment between ML±2mil
Min drilling0.15 mm
Min finished hole0.1 mm
Hole precision±2 mil(±50 um)
tolerance for Slot±3 mil(±75 um)
tolerance for PTH±3 mil(±75um)
tolerance for NPTH±2mil(±50um)
Max Aspect Ratio for PTH8:1
Hole wall copper thickness15-50um
Alignment of outer layers4mil/4mil
Min trace width/space for outer layer4mil/4mil
Tolerance of Etching+/-10%
Thickness of solder maskon trace0.4-1.2mil(10-30um)
at trace corner≥0.2mil(5um)
On base material≤+1.2mil
  Finished thickness
Hardness of solder mask6H
Alignment of solder mask film±2mil(+/-50um)
Min width of solder mask bridge4mil(100um)
Max hole with solder plug0.5mm
Surface finishHAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.
Max Nickel thickness for Gold finger280u"(7um)
Max gold thickness for Gold finger30u"(0.75um)
Nickel thickness in Immersion Gold120u"/240u"(3um/6um)
Gold thickness in Immersion Gold2u"/6u"(0.05um/0.15um)
Impedance control and its tolerance50±10%,75±10%,100±10% 110±10%
Trace Anti-stripped strength≥61B/in(≥107g/mm)
bow and twist
 
0.75%