1.2W/m.K Cooling Thermal Conductive Heatsink Soft Gap Pad
Specifications
1. High thermal conductivity
2. low thermal resistance
3. Stable performance
4. Low hardness
5. Easy to use
Applications:
1. LED lighting, lighting equipment
2. Household appliances, LCD display
3. Semiconductor and the radiating fin between
4. Communication product, intelligent mobile phone, tablet computer
5. Desktop computer, notebook and other portable computer
6. Large power supply etc.
Product Details :
Thermal Gap Filler Pad has excellent thermal conductivity and electrical insulation performance, in addition , it can meet the requirements of heat conducting and insulating radiating occasions with higher. At the same time, this product has the self adhesive, simple and convenient application. It's using silica gel itself the soft and elastic characteristics , place in the power heating device and heat dissipating structure parts, make the heat generated by the power module , effectively transmit to radiating parts, cooling system.
| Test Item | Product | Test Method |
| Model NO. | PM150 | -- |
| Thickness | 0.3~10mm | ASTM D 347 |
| Color | Blue / Grey | Visual |
| Continuous Use Temperature | -50~200 °C | TAG + DMA |
| Dielectric Breakdown Votage | 4.5KV ↑ | ASTM D 149 |
| Hardness | 20±5 | ASTM D 2240 |
| Thermal Conductivity | 1.2 w/m.k | ASTM D 5470 |
Performance and characteristics:
1.High thermal conductivity, heat transfer coefficient 2.6W/m-k
2.Stable performance , low thermal resistance, effectively improve the heat transfer rate
3.Low hardness, its viscosity high, easy to use adhesive
4.By UL and V-O certification standards
Product specification:
Size : 5mm * 30mm*30mm
Product standard size 310mm*310mm, 200mm*400mm according to customer needs cutting type The basic thickness 0.25mm*5.0mm, special size and thickness can be customized The product itself is slightly viscous, if need to strengthen the adhesive can be according to customer' requirement. Product color is mass production , if need special color can be adjusted according to the actual situation .