BGA Rework Station, mobile phone bga rework station, T862++, welding machine
Technical parameters
Power: 800W
Voltage: AC110V-220V 50/60HZ
Infrared lamp body power: 100W
Preheating plate power: 450W
Working bench size: 360*270mm
Infrared lamp body heating size: 35*35mm
Preheating plate size: 120*120mm
Preheating plate temperature range: 450
Infrared lamp body temperature range: 100-350
1. Infrared welding technology which was developed independently.
2. Infrared heating is easy to pierce and distribute evenly, can avoid the IC damage due to the fast or uninterrupted heating up.
3. Easy operate; User can operate skillfully after one-day training.
4. No need welding tools, it can weld any chips under 35mm (T-862++).
With hot melt system, preheating range 120*120mm (T-862++).
5. It doesn't impact the smart parts without hot air, and suits to weld all kinds of chips, especially Micro BGA components.
Working Voltage
| AC220V/50Hz AC110V/60Hz
|
Output power
| 800W
|
Infra-red lamp body temperature adjustable
| 100 -350
|
Preheating dish temperature adjustable
| 60 -200
|
Components
Description
| Quantity
| Illustration
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T-862++ Chassis
| 1
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PCB Board holder
| 1
|
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936 Searing-iron
| 1
|
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936 searing-iron rack
| 1
|
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Lamp Body and Lens(D= 28mm )
| 1
|
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Lens(D= 38mm )
| 1
|
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Lens(D= 48mm )
| 1
|
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Eye protection(IR Filter)
| 1
|
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Cell guide
| 1
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Focus holder
| 1
|
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Focus holder control knob
| 1
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Fasten nut for focus holder
| 1
|
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Steady ring
| 1
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Fasten nut for steady ring
| 1
|
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Power Cable (110VAC or 200VAC)
| 1
|
|
5mm Fuse, 10A 250VAC (Spare)
| 1
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CD User Manual w/Video
| 1
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