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Infrared BGA Balling Station, BGA Rework Station, Motherboard BGA Chips Repair Machine T- 862

China Infrared BGA Balling Station, BGA Rework Station, Motherboard BGA Chips Repair Machine T-862, Find details about China Bga Rework Station, Infrared Rework Station from Infrared BGA Balling Station, BGA Rework Station, Motherboard BGA Chips Repair Machine T-862

Model NO.
T862
HS Code
85151100
Model NO.
T862
HS Code
85151100
Infrared bga Balling Station, bga Rework Station, Motherboard bga chips Repair Machine T-862


Infrared BGA Balling Station, BGA Rework Station, Motherboard BGA Chips Repair Machine T-862

Technical parameters 862

Power: 600W
Voltage: AC110V-220V 50/60HZ
Infrared lamp body power: 100W
Preheating plate power: 350W
Working bench size: 350*260mm
Infrared lamp body heating size: 25*25mm
Preheating plate size: 120*80mm
Preheating plate temperature range: 450
Infrared lamp body temperature range: 100-350

Infrared BGA Balling Station, BGA Rework Station, Motherboard BGA Chips Repair Machine T-862

1. Infrared welding technology which was developed independently.
2. Infrared heating is easy to pierce and distribute evenly, can avoid the IC damage due to the fast or uninterrupted heating up.
3. Easy operate; User can operate skillfully after one-day training.
4. No need welding tools, it can weld any chips under 25mm (T-862).
With hot melt system, preheating range 120*80mm (T-862).
5. It doesn't impact the smart parts without hot air, and suits to weld all kinds of chips, especially Micro BGA components.

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