Products

Thermal Conductivity Silicone Grease for Electronic Module

China Thermal Conductivity Silicone Grease for Electronic Module, Find details about China Thermal Gel, Heat Paste from Thermal Conductivity Silicone Grease for Electronic Module

Model NO.
TS1001
CAS No.
63148-62-9
Formula
Al2O3
Bonding Function
Heatsink
Morphology
Paste
Application
Automobile, LED Light \CPU
Material
Silicone
Classification
Not Curing
Main Agent Composition
Polyurethane Elastomer
Characteristic
Heatsink
Promoter Composition
Curing Agent
Composition
Organic Material
Color
Grey
Model
Ts1001
Viscosity
80000cp
Thixotropy
1:6
Nvc
99.93%
Specify Gravity
2.0 Uncured
Thermal Conductivity
1.0
Thermal Resistance
0.09
Electric Strength
1.89kv/mm
Package
1000g/Bottle
Logo
Tensen/Customized
Trademark
Tensan/No mark/OEM
Transport Package
Normal Goods
Specification
1000g
Origin
China
HS Code
3824999990

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