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Low Temp Resistance Soft Silicone Thermal Conductive Pads for CPU

China Low Temp Resistance Soft Silicone Thermal Conductive Pads for CPU, Find details about China Thermal Pad, Silicone Pad from Low Temp Resistance Soft Silicone Thermal Conductive Pads for CPU

Model NO.
TS300
Material
Organic Silicone
Application
Industrial, Electronics
Certification
ISO, REACH, RoHS, 16949
Color
Grey
Usage
LED, Electronics, Computer etc.
Trade Term
EXW
Thermal Conductivity
3.0
Hardness
75/50
Thickness
0.5-0.75/1.0-5.0
Density
2.9
Shelf Life
18 Months
Means of Transportation
TNT, DHL, EMS
Other Service
OEM/ODM
Others
Free Sample Available
Trademark
TENSAN
Transport Package
Normal Packing
Specification
0.5--8mm
Origin
Shenzhen, China
HS Code
3920999090

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