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Cu/Mo/Cu (CMC) Heat Sink of GaAs Device Mount Material

China Cu/Mo/Cu (CMC) Heat Sink of GaAs Device Mount Material, Find details about China Cumocu, Heat Sink Material from Cu/Mo/Cu (CMC) Heat Sink of GaAs Device Mount Material

Model NO.
Cu1Mo3Cu1
Product Type
Heterotype
Material
Cu/Mo/Cu
Density
9.66g/cm3
Coefficent of Thermal Expansion
6.8
Electroplate Material
Gold
Transport Package
Vacuum Packing
Origin
China Pr
HS Code
854290000

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