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High Quality CMC (Cu/Mo/Cu) Heat Sinks of GaAs Device Mount

China High Quality CMC (Cu/Mo/Cu) Heat Sinks of GaAs Device Mount, Find details about China Cu/Mo/Cu Sandwich Composite, Heat Sink Material from High Quality CMC (Cu/Mo/Cu) Heat Sinks of GaAs Device Mount

Model NO.
Cu1Mo3Cu1
Product Type
Sheet
Material
Cu/Mo/Cu
Carbon Content
No
PCD
No
ET
No
Hole
No
Density
9.66g/cm3
Coefficent of Thermal Expansion
6.8
Electroplate Material
Au
Trademark
Qianyan
Transport Package
Vacuum Packing
Origin
China Pr
HS Code
854290000

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