Products

Copper Molybdenum Copper Heat Sink of GaAs Device Mount

China Copper Molybdenum Copper Heat Sink of GaAs Device Mount, Find details about China Cumocu, Heat Sink Material from Copper Molybdenum Copper Heat Sink of GaAs Device Mount

Model NO.
Cu1Mo3Cu1
Product Type
Heterotype
Material
Cu/Mo/Cu
Density
9.66g/cm3
Coefficent of Thermal Expansion
6.8
Electroplate Material
Gold
Transport Package
Vacuum Packing
Origin
China Pr
HS Code
854290000

You Might Also Like