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Copper-Molybdenum-Copper (CMC) Heat Sinks of Electronic Packing Materials
Copper-Molybdenum-Copper (CMC) Heat Sinks of Electronic Packing Materials

Copper-Molybdenum-Copper (CMC) Heat Sinks of Electronic Packing Materials

China Copper-Molybdenum-Copper (CMC) Heat Sinks of Electronic Packing Materials, Find details about China Cumocu, Heat Sink Material from Copper-Molybdenum-Copper (CMC) Heat Sinks of Electronic Packing Materials

Model NO.
Cu1Mo1Cu1
Product Type
Sheet
Material
Cu/Mo/Cu
Density
9.32g/cm3
Coefficent of Thermal Expansion
8.8
Transport Package
Vacuum Packing
Origin
China Pr
HS Code
854290000

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