Heat Sinks Electronic Packing Materials Copper Molybdenum Copper
China Heat Sinks Electronic Packing Materials Copper Molybdenum Copper, Find details about China Cu/Mo/Cu Sandwich Composite, Heat Sink Material from Heat Sinks Electronic Packing Materials Copper Molybdenum Copper
Basic Info.
Model NO.
Cu1Mo4Cu1
Product Type
Heterotype
Material
Cu/Mo/Cu
Density
9.75g/cm3
Coefficent of Thermal Expansion
6.0
Electroplate Material
Gold
Transport Package
Vacuum Packing
Origin
China Pr
HS Code
854290000
Product Desciption
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