High Thermal Conductivity Aluminum Nitride Aln Ceramic Disc

China High Thermal Conductivity Aluminum Nitride Aln Ceramic Disc, Find details about China Aln Substrate, Aluminum Nitride Ceramic from High Thermal Conductivity Aluminum Nitride Aln Ceramic Disc

Model NO.
HBQ618
Advantage
High Thermal Conductivity
Thermal Conductivi
180~230W/M-K
Water Absorpti
0
Density
3.3/Cm3
Linear Expansion Coefficie
4.4
Flexural Streng
>330
Bulk Resistan
>1014
Dielectric Consta
9.0
Surface Roughne
0.3-0.5
Camber
0.03-0.05
Keyword
Machined High Thermal Conductivity Aluminum Nitrid
Trademark
OEM
Transport Package
1.Plastic Air Cushion Film 2.Foam Material 3.Car
Specification
Custom
Origin
China
Model NO.
HBQ618
Advantage
High Thermal Conductivity
Thermal Conductivi
180~230W/M-K
Water Absorpti
0
Density
3.3/Cm3
Linear Expansion Coefficie
4.4
Flexural Streng
>330
Bulk Resistan
>1014
Dielectric Consta
9.0
Surface Roughne
0.3-0.5
Camber
0.03-0.05
Keyword
Machined High Thermal Conductivity Aluminum Nitrid
Trademark
OEM
Transport Package
1.Plastic Air Cushion Film 2.Foam Material 3.Car
Specification
Custom
Origin
China
 

High Thermal Conductivity Aluminum Nitride Aln Ceramic Disc

 

Product Description

 
Product Name
  Machined High Thermal Conductivity Aluminum Nitride Aln Ceramic Disc
Color
Gray
Size
As per drawing
Processing
Polishing,Laser cutting,Slloting etc.
Payment
T/T,Western Union,Online payment by credit card are available
Application
It is widely used as Heat radiation substrate/Chamber parts for semiconductor process equipment.
Thransport
Air transport: 5-10 days; Ocean shipping: About one month.
Delivery Time
1.Stock:delivery within 3-5 days after receiving your payment.
2. OEM/ODM:The normal Lead time is 15-45 days, which depends on your quantiy.

Detailed Photos

High Thermal Conductivity Aluminum Nitride Aln Ceramic Disc

Aluminum nitride wafer


Aluminum nitride ceramic thermal plate, high thermal conductivity, low coefficient of expansion, high Strength, high temperature resistance, chemical resistance, high resistivity , low dielectric loss, is the ideal LSI heat dissipation board and packaging materials.Aluminum nitride ceramic plate use heat resistant melt erosion and thermal shock resistance,Can produce GaAs crystal crucible, Al evaporation pan, MHD power generation equipment and highTemperature turbine corrosion resistant parts, using its optical properties can be used as an infrared Window.

 

Features of ALN disc

1)High thermal conductivity of more than 170W/m. K,
2)High resistivity,
3)Low dielectric loss,
4)Good insulation,
5)Some other excellent properties

 
 
High Thermal Conductivity Aluminum Nitride Aln Ceramic Disc
High Thermal Conductivity Aluminum Nitride Aln Ceramic Disc
Material Properties
 
Material Properties of Aluminum Nitride Substrate/Wafer
Property ContentProperty Index
Density(g/cm3)3.335
Resistance to Thermal ShockNo Cracks
Thermal conductivity(30°C, W/m.k)≥170
Linear expansion coefficient
(/°C, 5°C/min, 20-300°C)
2.805×10-6
Flexural strength (MPa)382.7
Volume Resistivity (Ω.cm)1.4×1014
Dielectric constant(1MHz)8.56
Chemical Durability (mg/cm2)0.97
Dielectric strength (KV/mm)18.45
Surface roughness Ra(μm)0.3~0.5
Camber (length‰)≤2‰
Appearance/ ColorDense/ Dark Gray

 

Certifications

High Thermal Conductivity Aluminum Nitride Aln Ceramic Disc
High Thermal Conductivity Aluminum Nitride Aln Ceramic DiscHigh Thermal Conductivity Aluminum Nitride Aln Ceramic Disc

Company Profile

High Thermal Conductivity Aluminum Nitride Aln Ceramic Disc
Lianyungang Highborn Technology CO.,LTD



Is a leading high-tech ceramic development and production enterprises.
Our ceramic products are widely used in various fields of automotive, metallurgy, machinery, electronic & electrical, food, chemical, medical and so on. With experienced engineers and talented workers, we are able to evaluate projects and drawings properly, make valuable suggestion, supply satisfying products. Our materials including:
- Alumina ceramic tube, alumina parts( 95% 96% 99% 99.5% 99.7% Al2O3 )
- Zirconia cermaic ( Yttria stabilized ZrO2 )
- Silicon Nitride ( GPS Gas pressure sintered & Hot pressed Si3N4 )
- Silicon carbide
- Boron Carbide ( B4C )
- Boron Nitride ( Hot pressed BN )
- Machinable Glass Ceramic
- Steatite, cordierite

High Thermal Conductivity Aluminum Nitride Aln Ceramic Disc

Packaging & Shipping

High Thermal Conductivity Aluminum Nitride Aln Ceramic Disc

 

FAQ

Q:Are you a trading company or a manufacturer?

A:We are professional manufacturer which has almost 10 years of experience in this industry.


Q:Can you produce according to the samples?

A:Yes,we can produce by your samples or technical drawings.


Q:Would it be possible for us to visit your factory?

A:Sure,we welcomed our customers visit our factory in any time.


Q:Will your company supply samples?

A:Yes,the sample expense will be deducted from the value of your order.


Q:What's your payment terms?

A:T/T, L/C, Western Union, Money Gram, are available for us.


Q:Delivery time for my order?

A:Within 7-15 working days for your sample order; 20 working days for your bulk order( It depends on the models and quantity you are going to order)