BGA Rework Station, bga reballing station, laptop repair tool T-835

1 - Features

1. Adopt hand-held lamp structure with flexible operation and easy control. T835 is suitable for any points of a flat component, especially BGA, SMD components.
2. Use infrared heat lamp. Heat is easy to pierce and distribute evenly, which overcome disadvantages (burn out elements) of traditional welder machines...
3. Infrared heating don't have sirocco flow. Don't impact circumjacent small elements. It is suitable for all of the elements. It can be used to unsolder BGA, SMD, CSP, LGA, QFP and PLCC, especially Micro BGA and SMD elements. T835 works together with infrared preheated T-8120, which can repair all kinds of needle-socket (such as CPU socket and inserted row GAP).
4. Easy operation. Just need one-day training, you can operation it skillfully. Don't need any welding tools. This machine can solder all the flat components.
5. T-835 will satisfy soldering/unsoldering of phones, computers, notebooks, Game machines, etc.

2 - Technical Parameter

Rated voltage and frequency AC220V/AC110V/50-60Hz
Complete machine power 300W
Infra-red lamp power 100W
Infra-red lamp heating size Φ 35mm
Adjustable temperature of Infra-red lamp 0-350