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Infrared BGA Machine Reballing with Solder Iron and Laser Positioning for All of Motherboard Repairing
Infrared BGA Machine Reballing with Solder Iron and Laser Positioning for All of Motherboard Repairing

Infrared BGA Machine Reballing with Solder Iron and Laser Positioning for All of Motherboard Repairing

China Infrared BGA Machine Reballing with Solder Iron and Laser Positioning for All of Motherboard Repairing, Find details about China Infrared BGA Reballing Machine, Chip Reballing Machine from Infrared BGA Machine Reballing with Solder Iron and Laser Positioning for All of Motherboard Repairing

Model NO.
DH-A1L
Product Name
Infrared BGA Reballing Machine
Total Power
4900W
Top Hot Air Heating
800W
Bottom Heating
Bottom Hot Air Heating 1200W, IR Preheating 2700W
Power
110V/220V(Optional)
Temperature Accuracy
+/- 2 ºC
PCB Size
Min 22mmx22mm, Max 500mmx450mm
BGA Chips
2X2mm-80X80mm
Trademark
Dinghua
Transport Package
Wooden Box
Specification
CE, ISO9001
Origin
Shenzhen
HS Code
8515809090

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