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Mulitlayer PCB 4 Layer Copper-Clad Laminate Fr4

China Mulitlayer PCB 4 Layer Copper-Clad Laminate Fr4, Find details about China PCB Board, Circuit Board from Mulitlayer PCB 4 Layer Copper-Clad Laminate Fr4

Model NO.
BIC-177-V1.77
Type
Rigid Circuit Board
Dielectric
FR-4
Material
Fiberglass Epoxy
Application
Medical Instruments
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Final Foil External
1 Oz
Final Height of PCB
1.6mm
Surface Finish
Hot Air Soldering Leveling(HASL)
Solder Mask Color
Gloss Green, Taiyo Psr-2000gt600d
Colour of Component Legend
White, Ijr-4000 MW300, Taiyo Supplied.
Minimum Trace and Space
5.4 Mil/5.4 Mil
Minimum / Maximum Holes
2.1mm /3.2mm
Test
100% Electrical Test Prior Shipment
Via
Plated Through Hole(Pth)
Acceptable Files Format
Gerber RS-274-X and Pcbdoc 
Trademark
Bicheng Enterprise Limited
Transport Package
Vacuum
Specification
32 x 45mm=1PCS
Origin
China
HS Code
8534009000

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