Double Component Clear Thermal Conductive Solar Encapsulant Silicone

China Double Component Clear Thermal Conductive Solar Encapsulant Silicone, Find details about China Solar Encapsulant Silicone, Thermal Conductive Solar Encapsulant Silicone from Double Component Clear Thermal Conductive Solar Encapsulant Silicone

Model NO.
BM800
Characteristic
Waterproof
Promoter Composition
Curing Agent
Composition
Organic Material
Color
Clear
Hardness
55±5
Usage
Electronic Components
Conductivity Factor
1.2
Viscosity
4500±1500
Maximum Voltage
<10kv
Type
Liquid Glue
Density
1.85±0.05
Mixing Ration
100 100
Certification
SGS, ISO9001
Trademark
JRFT
Transport Package
Carton
Specification
Customize
Origin
China
HS Code
3506919090
Model NO.
BM800
Characteristic
Waterproof
Promoter Composition
Curing Agent
Composition
Organic Material
Color
Clear
Hardness
55±5
Usage
Electronic Components
Conductivity Factor
1.2
Viscosity
4500±1500
Maximum Voltage
<10kv
Type
Liquid Glue
Density
1.85±0.05
Mixing Ration
100 100
Certification
SGS, ISO9001
Trademark
JRFT
Transport Package
Carton
Specification
Customize
Origin
China
HS Code
3506919090
Double Component Clear Thermal Conductive Solar Encapsulant Silicone

Double Component Clear Thermal Conductive Solar Encapsulant Silicone

Features:
High thermal conductivity --provides the highest thermal conductivity with its viscosity range in the world.
Low Stress--exhibits low shrinkage and stress on components as it is curing;low thermal expansion after curing.
Highly reliable--composed of an addition-curing polydimethly siloxane polymer that will not deploymerize when heated in confined spaces.
Low Viscosity--maintains low viscosity for ease of component encapsulation compared to other highly thermal conductive materials.
Environmentally Resistant--provides excellent thermal shock resistance.
UL Rated--meets requirements of UL 94 V-O standard;provides excellent flame retardancy.

 
 
 
Application:
 

1.IC potting 
 
2.electronic watches,
 
3.calculators,
 
4.computers,
 
5.LCD modules,
 
6.e-books,
 
7.semiconductor components and
 
8.COB bonding



Product Description:
 
The thermal conductive glue add molding organic silicone sealant, use imported organic silicone as the main material, select the polymer materials as fillers, manufactured elaborately electronic potting glue, glue viscosity is divided into high, middle, low three type, color also can be optional according to customer's demand, and has heat conducting, flame retardant, bonding, sealing, waterproof, potting and encapsulation properties.
 


Contact Information : 

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