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Mould Pressing Tungsten Copper Alloy Plate for Heat Sink Packaging

China Mould Pressing Tungsten Copper Alloy Plate for Heat Sink Packaging, Find details about China Tungsten Copper, Wcu from Mould Pressing Tungsten Copper Alloy Plate for Heat Sink Packaging

Model NO.
WCu
Application
Aviation, Electronics, Industrial, Medical, Chemical, Heat Sink Electronic Packaging
Standard
GB, ASTM
Purity
W50-90%
Alloy
Alloy
Shape
Rectangular
Type
Tungsten Copper Plate
Material
Wcu10-50%
Surface
Bright
Technology
Mould Pressing
Usage
Heat Sink Encapsulation
Trademark
DINGDING
Transport Package
Plywood Box with Foam and Plastic Film
Specification
ISO9001: 2008, SGS
Origin
Luoyang
HS Code
8101991000

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