Products

Immersion Gold 1-20layers Green Ink PCB Manufacturingmultilayer PCB Black Doule Side PCB

China Immersion Gold 1-20layers Green Ink PCB Manufacturingmultilayer PCB Black Doule Side PCB, Find details about China Double Side PCB, PCB from Immersion Gold 1-20layers Green Ink PCB Manufacturingmultilayer PCB Black Doule Side PCB

Model NO.
PCB-08
Base Material
Fr-4
Insulation Materials
Organic Resin
Model
PCB
Brand
Zapon
Surface
OSP,Immersion Gold,Hal Lead Free,Hal
Solder Mask
Green,Red,Yellow,White,Black,Blue,etc
Shipment
Air,Sea,Express(DHL TNT FedEx EMS UPS)
Sample Date
3-5days
Trademark
ZAPON
Transport Package
Vacuum Packing
Specification
UL ISO TS16949 IPC3
Origin
China
HS Code
85340090
Model NO.
PCB-08
Base Material
Fr-4
Insulation Materials
Organic Resin
Model
PCB
Brand
Zapon
Surface
OSP,Immersion Gold,Hal Lead Free,Hal
Solder Mask
Green,Red,Yellow,White,Black,Blue,etc
Shipment
Air,Sea,Express(DHL TNT FedEx EMS UPS)
Sample Date
3-5days
Trademark
ZAPON
Transport Package
Vacuum Packing
Specification
UL ISO TS16949 IPC3
Origin
China
HS Code
85340090
ZHEJIANG ZAPON ELECTRONIC TECHNOLOGY Co., Ltd is a professional manufacture of PCB and PCBA. Which have the factory of single side PCB, double side PCB, multi-layer PCB and PCB assembly etc. We have the ability of produce for any medium and mass quantity. The machine of our factory are on work all day and all night. With Zapon as a supplier, you will have the highest quality, quickest delivery.

The products:
Single-side PCB: CEM-1, FR-2, FR-1 XPC-94HB
Double-side PCB: FR-4, CEM-3, High Tg, Aluminum, Halogen Free
Multi-layer PCB: 4 to 22 layers(FR-4, High Tg, Rogers)
Certification: UL, ISO9001, ISO/TS16949: 2002, IS014001 and RoHS
THE CAPACITY OF PRODUCTION: 50, 000SQM. /month

We promise:

Reliable quality
Reasonable price
Flexible lead time
Item
 		Capabilities
 
Number of Layers
 		Double Side
 
Material
 		FR-4,CEM-3,HighTg, Aluminum,
Halogen Free
 
PCB Thickness
 		Min.thickness
 		0.2mm(8mil)
 
Max.thickness
 		3.2mm(128mil)
 

Surface finished
 		Gold Plating
 
Immersion Gold(Silver)
 
HAL Lead Free
 
Hot Air Solder Leveling(HASL)
 
Entek Coating (OSP)
 
Solder Mask
 		Green,White,Black,Yellow,Red,Blue
 
Other printing
 		Gold Finger
 
Carbon Print, Peelable Mask
 
Solder Mask Plugged Hole
 
Copper thickness
 		1/ 2 oz (18 μm) - 4 oz (140 μm)
 
Min. Finished Hole Size
 		0.3mm(12mil)
 
Hole Size Tolerance (PTH)
 		+/ -0.076mm (3 mil)
 
Hole Size Tolerance (NPTH)
 		+/-0.05mm (2 mil)
 
Min. Line Width and Spacing
 		0.10mm (4 mil)
 
Min. Solder Mask Clearance
 		0.076mm (3 mil)
 
Min. Annular Ring
 		0.1mm (4mil)
 
Profile and V-Cut
 		CNC-Routing, Stamping and Beveling,V-CUT,CNC

 
Special Process
 		Micro-section, Chamfer for Gold Finger
 

You Might Also Like