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Tim Material Thermal Conductive Silicone CPU Thermal Silica Gel Pad for Heat Sink

China Tim Material Thermal Conductive Silicone CPU Thermal Silica Gel Pad for Heat Sink, Find details about China Silicone Pad, Thermal Silicone Pad from Tim Material Thermal Conductive Silicone CPU Thermal Silica Gel Pad for Heat Sink

Model NO.
SK Series
Application
Thermal Interface Materials
Type
Thermal Interface Materials
Chemistry
Silicone
Material
Silicone
Thermal Rating
-50~+200
Maximum Voltage
>=10 Kv/mm
Classification
Thermal Interface Materials
Certification
UL, ISO9001, RoHS and Reach
Color
Customized
Brand
Sk
Thermal Conductivity
1.2W/M.K~8W/M.K
Trademark
DSN
Transport Package
Blister Bag/ Bubble Bag
Specification
Customized Size
Origin
Suzhou

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