China HDI Blind and Buried Vias PCB Printed Circuit Board Made of Fr4 Tg180, Find details about China PCB, PCBA from HDI Blind and Buried Vias PCB Printed Circuit Board Made of Fr4 Tg180
Item | Production Capacity |
Layer Counts | 1-20 layers |
Material | FR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON etc. |
Board thickness | 0.20mm-8.00mm |
Maximum Size | 600mmX1200mm |
Board Outline Tolerance | +0.10mm |
Thickness Tolerance(t≥0.8mm) | ±8% |
Thickness Tolerance(t<0.8mm) | ±10% |
Insulation Layer Thickness | 0.075mm--5.00mm |
Minimum Line | 0.075mm |
Minimum Space | 0.075mm |
Out Layer Copper Thickness | 18um--350um |
Inner Layer Copper Thickness | 17um--175um |
Drilling Hole(Mechanical) | 0.15mm--6.35mm |
Finish Hole(Mechanical) | 0.10mm-6.30mm |
Diameter Tolerance(Mechanical) | 0.05mm |
Registration(Mechanical) | 0.075mm |
Aspect Ratio | 16:1 |
Solder Mask Type | LPI |
SMT Mini.Solder Mask Width | 0.075mm |
Mini. Solder Mask Clearance | 0.05mm |
Plug Hole Diameter | 0.25mm--0.60mm |
Impedance control Tolerance | ±10% |
Surface finish/treatment | HASL,ENIG,Chem,Tin,Flash Gold, OSP, Gold Finger |
Production capacity of hot-sale products | |
Double Side/Multilayer PCB Workshop | Aluminum PCB Workshop |
Technical Capability | Technical Capability |
Raw materials: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Raw materials: Alurminum base, Copper base |
Layer: 1 layer to 20 Layers | Layer: 1 layer and 2 Layers |
Min.line width/space: 3mil/3mil(0.075mm/0.075mm) | Min.line width/space: 4mil/4mil(0.1mm/0.1mm) |
Min.Hole size: 0.1mm(dirilling hole) | Min.Hole size: 12mil(0.3mm) |
Max. Board size: 1200mm* 600mm | Max.Board size: 1200mm* 560mm(47in* 22in) |
Finished board thickness: 0.2mm- 6.0mm | Finished board thickness: 0.3~ 5mm |
Copper foil thickness: 18um~280um(0.5oz~8oz) | Copper foil thickness: 35um~210um(1oz~6oz) |
NPTH Hole Tolerance: +/-0.075mm, PTH hole Tolerance: +/-0.05mm | Hole position tolerance: +/-0.05mm |
Outline Tolerance: +/-0.13mm | Routing outline tolerance: +/ 0.15mm; punching outline tolerance:+/ 0.1mm |
Surface finished: Lead free HASL, immersion gold(ENIG), immersion silver, OSP, gold plating, gold finger, Carbon INK. | Surface finished: Lead free HASL, immersion gold(ENIG), immersion silver, OSP etc |
Impedance control tolerance: +/-10% | Remain thickness tolerance: +/-0.1mm |
Production capability: 50,000 s.q.m/month | MC PCB Production capability: 10,000 s.q.m/month |
Category | Quickest Lead Time | Normal Lead Time |
Double sideds | 24hrs | 120hrs |
4 Layers | 48hrs | 172hrs |
6 Layers | 72hrs | 192hrs |
8 Layers | 96hrs | 212hrs |
10 Layers | 120hrs | 268hrs |
12 Layers | 120hrs | 280hrs |
14 Layers | 144hrs | 292hrs |
16-20 Layers | Depends on the specific requirements | |
Above 20 Layers | Depends on the specific requirements |