Blue Solder Mask Brushless Controller Printed Circuit Board Assembly
China Blue Solder Mask Brushless Controller Printed Circuit Board Assembly, Find details about China Brushless Controller, Printed Circuit Board Assembly from Blue Solder Mask Brushless Controller Printed Circuit Board Assembly
Basic Info.
Model NO.
OKEY PCBA
Base Material
Copper
Insulation Materials
Epoxy Resin
Model
FR-4
Brand
Okey PCBA
Application
Electronic Products
Customized
Customizable
Quality Standard
Ipc 610 Class II
Certificate
RoHS, SGS, Reach, UL, ISO 9000, ISO 14000
Board Thickness
0.4-2.0mm
Surface Finihsing
OSP, HASL, Lf HASL, Enig, Carbon Oil, Enepig
Lead Time
6-8 Workdays
Solder Mask Color
Green, White, Black, Blue, Yellow, Red, Purple
Silkscreen Color
Green, White, Black, Blue, Yellow
Copper Thickness
0.5-4 Oz
Layer
1-20 Layers
Board Material
Fr4, H-Tg, Cem, Aluminum, Copper Base, Teflon
PCB Testing
E-Test, Fly Probe Test, Visual Checking
PCBA Testing
Aoi, Ict, Fct, Burn-in, Vibration Test
Transportation
DHL, TNT, UPS, FedEx IP/Ie, EMS, Air/Sea Shipment
Trademark
OKEY PCBA
Transport Package
Inner Vaccun Outer Carton
Specification
330*260*210mm
Origin
Shenzhen China
HS Code
8534009000
Model NO.
OKEY PCBA
Base Material
Copper
Insulation Materials
Epoxy Resin
Model
FR-4
Brand
Okey PCBA
Application
Electronic Products
Customized
Customizable
Quality Standard
Ipc 610 Class II
Certificate
RoHS, SGS, Reach, UL, ISO 9000, ISO 14000
Board Thickness
0.4-2.0mm
Surface Finihsing
OSP, HASL, Lf HASL, Enig, Carbon Oil, Enepig
Lead Time
6-8 Workdays
Solder Mask Color
Green, White, Black, Blue, Yellow, Red, Purple
Silkscreen Color
Green, White, Black, Blue, Yellow
Copper Thickness
0.5-4 Oz
Layer
1-20 Layers
Board Material
Fr4, H-Tg, Cem, Aluminum, Copper Base, Teflon
PCB Testing
E-Test, Fly Probe Test, Visual Checking
PCBA Testing
Aoi, Ict, Fct, Burn-in, Vibration Test
Transportation
DHL, TNT, UPS, FedEx IP/Ie, EMS, Air/Sea Shipment
Trademark
OKEY PCBA
Transport Package
Inner Vaccun Outer Carton
Specification
330*260*210mm
Origin
Shenzhen China
HS Code
8534009000
Product Desciption
Our Products:
About us:
Shenzhen Okey Circuit Co.,Ltd provides a one-stop electronic ODM service,from design,components sourcing,PCB production,SMT assembly,DIP assembly,hand soldering, PCBA testing,case assembly to finished products.
Since its establishment in 2006, our products are widely used in computer, audio, digital products, household appliances, automotive, medical, mobile phones, automation equipment, communication products and other industries.
Our production lines are equipped with automatic machines totally high speed and high accuracy. Our min. SMD component precision can meet 0201, and THT precision down to 0.6mm, skilled in ball grid array (BGA) assembly. All products fully conducted test, AOI test, functional text, burn-in test to secure product quality. We fully follow IPC-A-610E class II and class III standard.
High-quality product, reasonable price, fast delivery and good service are always our promise.
PCB&PCBA Capabilities:
| SHENZHEN OKEY CIRCUIT CO.,LTD | |
| PCB Manufacturing Capabilities: | |
| Layers | 1-20 Layers |
| Laminate | FR4, H-TG, CEM, Aluminum, Copper Base, Teflon, Rogers, |
| Ceramics, Iron Base | |
| Max. Board Size | 1200*480mm |
| Min.Board Thickness | 2-Layer 0.15mm |
| 4-Layer 0.4mm | |
| 6-Layer 0.6mm | |
| 8-Layer 1.5mm | |
| 10-Layer 1.6-2.0mm | |
| Min. Line Width/Trace | 0.1mm(4mil) |
| Max. Copper Thickness | 10 OZ |
| Min. S/M Pitch | 0.1mm(4mil) |
| Max. S/M Pitch | 0.2mm(8mil) |
| Min. Hole Dia. | 0.2mm(8mil) |
| Hole Dia. Tolerance(PTH) | ±0.05mm(2mil) |
| Hole Dia. Tolerance(NPTH) | ±0.05mm(2mil) |
| Hole Position Deviation | ±0.05mm(2mil) |
| Outline Tolerance | ±0.1mm(4mil) |
| Twist/Bent | 0.75% |
| Insulation Resistance | >1012Ω Normal |
| Electric Strength | >1.3kv/mm |
| S/M Abrasion | >6H |
| Thermal Stress | 288ºC 10Sec |
| Test Voltage | 50-300V |
| Min. Blind/Buried Via | 0.15mm(6mil) |
| Surface Treatment | OSP,HASL,LF-HASL,ENIG,Gold/Au Plating,Immersion Ag/Silver, |
| Ag/Silver Plating,Immersion Tin,Tin Plating | |
| Testing | E-test, Fly probe test |
| PCB Assembly Manufacturing Capabilities: | |
| Type of Assembly | SMT (Surface-Mount Technology) |
| DIP (Dual Inline-pin Package) | |
| SMT & DIP mixed | |
| Double-sided SMT and DIP assembly | |
| Solder Type | Water Soluble Solder Paste, Leaded process and Lead-Free (RoHS) |
| Components | Passives parts, smallest size 0201 |
| BGA, uBGA, QFN, SOP, TTSOP, and Leadless chips | |
| Fine Pitch to 0.8Mils | |
| BGA Repair and Reball, Part Removal and Replacement | |
| Connectors and Terminals | |
| Bare Board Size | Smallest:0.25''x 0.25'' (6.35mm x 6.35mm) |
| Largest: 20'' x 20'' (508mm x 508mm) | |
| Largest LED PCB: 47'' x 39'' (1200mm x 480mm) | |
| Min. IC Pitch | 0.012'' (0.3mm) |
| QFN Lead Pitch | 0.012'' (0.3mm) |
| Max. BGA size | 2.90'' x 2.90'' (74mm x 74mm) |
| Testing | X-ray Inspection |
| AOI (Automated Optical Inspection) | |
| ICT (In-Circuit Test)/Functional Testing | |
| Component Packaging | Reels, cut tape, Tube and tray, Loose parts and bulk |
Quality Compare:
Testing+Packing+Shipping:
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