Insulates Epoxy Resin Potting Compound for Electronic Encapsulation

China Insulates Epoxy Resin Potting Compound for Electronic Encapsulation, Find details about China Epoxy Resin, Anti-Leakage from Insulates Epoxy Resin Potting Compound for Electronic Encapsulation

Model NO.
YH-915
Method
Brush
Drying Method
Air Drying
Certification
ISO14001, CCC, RoHS, ISO9001, UL
Components
Epoxy
Formation Mechanism
Conversion Type
Application
Electronic Component Sealling
Another Name
Epoxy Adhesive
Advantage
Suitable High Temperate Climates
Package
Bottle
MOQ
1kg
Viscosity
2000-3000cps
Type
Two Component
Classification
Double Components Adhesives
Product Name
Epoxy Resin for Electronic Components
Keywords
Epoxy Resin Liquid
Material
Pure Epoxy
Trademark
Boqiao
Origin
China
HS Code
3506912000
Model NO.
YH-915
Method
Brush
Drying Method
Air Drying
Certification
ISO14001, CCC, RoHS, ISO9001, UL
Components
Epoxy
Formation Mechanism
Conversion Type
Application
Electronic Component Sealling
Another Name
Epoxy Adhesive
Advantage
Suitable High Temperate Climates
Package
Bottle
MOQ
1kg
Viscosity
2000-3000cps
Type
Two Component
Classification
Double Components Adhesives
Product Name
Epoxy Resin for Electronic Components
Keywords
Epoxy Resin Liquid
Material
Pure Epoxy
Trademark
Boqiao
Origin
China
HS Code
3506912000

Packaging & Delivery

Selling Units:
Single item
Single package size: 
12X8X12 cm
Single gross weight:
2.000 kg
Package Type:
By air : 200g, 400g, 800g, 1kg, 5kg pack in bottle. outer packing: carton By ocean: 20kg per bucket, outer packing: wooden box. with 8-12 buckets per wooden box
Picture Example:
 

Lead Time:
Quantity(Kilograms)1 - 56 - 100101 - 500>500
Est. Time(days)123To be negotiated
 
High Quality Price Per KG Odorless Hardness Epoxy Resin For Electronic compound

Product Description
Insulates Epoxy Resin Potting Compound for Electronic Encapsulation

 
 
 
SPECIFICATION

High Quality Price Per KG Odorless Hardness Epoxy Resin For Electronic compound 

 

product name

High Quality Price Per KG Odorless Hardness Epoxy Resin For Electronic compound

Model number

YH200A/B-3

Component

Part A

Part B

 

Before curing

Appearance

Transparent to light yellow liquid

Brown liquid

Proportion g/cm3

 25ºC

1.16±0.05

1.13±0.05

Viscosity  (mpa.s)  25ºC

1800~3200

3#/12

60~75

1#/60

Mixed Viscosity (mpa.s 25ºC

600~900

2#/12

Part A:Part B(Weight Ratio)

5:1

Solidification conditions (10±0.5g)

Spec. 38×8mm

Condensation 25ºC     30mins

Solidify 60ºC          90 mins        hardness 81

Hardness    (SHORE  D )

 Mixed initial period        Shore ≥80

After sulfuric acid impregnation      ±1HD

ABS Tensile shear strength

Temp. (60ºC/90mins )      6.5±1Mpa

Temp.(25ºC/24 hours)     4.8±1Mpa

Operative time 25ºC

150g                20-25mins

300g               15-20mins

weight change after impregnation by Sulfuric acid  

<2%

Life Span

6 months

 
 

 
APPLICATION

Insulates Epoxy Resin Potting Compound for Electronic EncapsulationInsulates Epoxy Resin Potting Compound for Electronic EncapsulationInsulates Epoxy Resin Potting Compound for Electronic Encapsulation
    Packing

Insulates Epoxy Resin Potting Compound for Electronic Encapsulation
Insulates Epoxy Resin Potting Compound for Electronic Encapsulation
Insulates Epoxy Resin Potting Compound for Electronic Encapsulation
Insulates Epoxy Resin Potting Compound for Electronic EncapsulationInsulates Epoxy Resin Potting Compound for Electronic Encapsulation
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Insulates Epoxy Resin Potting Compound for Electronic Encapsulation

Insulates Epoxy Resin Potting Compound for Electronic Encapsulation