China Insulates Epoxy Resin Potting Compound for Electronic Encapsulation, Find details about China Epoxy Resin, Anti-Leakage from Insulates Epoxy Resin Potting Compound for Electronic Encapsulation
Quantity(Kilograms) | 1 - 5 | 6 - 100 | 101 - 500 | >500 |
Est. Time(days) | 1 | 2 | 3 | To be negotiated |
SPECIFICATION |
High Quality Price Per KG Odorless Hardness Epoxy Resin For Electronic compound
product name | High Quality Price Per KG Odorless Hardness Epoxy Resin For Electronic compound | ||
Model number | YH200A/B-3 | ||
Component | Part A | Part B | |
Before curing | Appearance | Transparent to light yellow liquid | Brown liquid |
Proportion g/cm3 25ºC | 1.16±0.05 | 1.13±0.05 | |
Viscosity (mpa.s) 25ºC | 1800~3200 3#/12 | 60~75 1#/60 | |
Mixed Viscosity (mpa.s) 25ºC | 600~900 2#/12 | ||
Part A:Part B(Weight Ratio) | 5:1 | ||
Solidification conditions (10±0.5g) Spec. 38×8mm | Condensation 25ºC 30mins Solidify 60ºC 90 mins hardness 81 | ||
Hardness (SHORE D ) | Mixed initial period Shore ≥80 After sulfuric acid impregnation ±1HD | ||
ABS Tensile shear strength | Temp. (60ºC/90mins ) 6.5±1Mpa | ||
Temp.(25ºC/24 hours) 4.8±1Mpa | |||
Operative time 25ºC | 150g 20-25mins | ||
300g 15-20mins | |||
weight change after impregnation by Sulfuric acid | <2% | ||
Life Span | 6 months |
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Packing |