China Hot-Sale HDI Multilayer Printed Circuit Board Fr4 PCB Power Electronics, Machine Vision PCB, Find details about China Motherboard, Industrial from Hot-Sale HDI Multilayer Printed Circuit Board Fr4 PCB Power Electronics, Machine Vision PCB
Shenzhen Golden Tech Micron Technology is affiliated to Guangdong Kingshine Electronics Co., Ltd.
We're one of the well-known domestic high-tech PCB manufacturers with much influence in China and work with famous companies such as :
CRRC | BMW | BYD | Ford | Flextronics | Dahua | Star-net |
Sungrow | Huawei | ZTE | Longcheer | TCL | XGD | Jabil |
Our company was established in 2001, specializing in the development, production and sales of high-density printed circuit boards,
including :
*Single-sided, |
*Double-sided |
*Multilayer |
*HDI |
*High frequency & speed |
*Aluminium |
*Rigid & flex |
*IC-substrate |
We have obtained more than 100 national invention patents and utility model patents and has passed UL safety certification, ISO9001, ISO14001, OHSAS18000 and other management certification systems.
Model Number: | PCB & PCB Assembly |
Base Material | FR-4,Hi-TG FR4,CEM-3,Aluminum,Rogers,Shengyi |
Copper Thickness: | 0.3oz-6oz |
Board Thickness: | 0.2mm-7mm |
Min. Hole Size: | 0.1mm |
Min. Line Width: | 2.5mil |
Min. Line Spacing: | 2.5mil |
Surface Finishing: | HASL, ENIG, OSP, HASL Lf, ENEPIG, IMMERSION SILVER, IMMERSION TIN, GOLD FINGER, PLATING HARD GOLD, BLUE MASK SOLDER, |
Layer No. | 1-48L Layers |
PCB Test: | Flying probe and AOI (Default)/Fixture Test |
Base, Cover film, Stiffeners thickness:: | 0.5mil, 1.0mil, 2.0mil, 3.0mil, 4.0mil, 5.0mil, 6.0mil,0.10um |
BGA Ball Pitch: | 1mm ~ 3mm(4mil ~ 12mil) |
PCB Assembly Method: | SMT, Through-hole, Mixed, BGA |
PCB Assembly Test: | Visual Inspection (default), AOI, FCT, X-RAY |
Hi-TG FR4 Material: | Tg-130 Tg-140 Tg-160 Tg-170 |
Electrical Testing: | Net List Test, Flying Probe Test, Through Hole Test, Dual Access Test |
Certificate Standard: | IPC-A-600H Class 2, Class 3, TS16949, RoHS and as your need |
Special requirements: | Buried and blind vias, Impedance control, via plug, BGA soldering etc. |
Supply Ability | 2.6 million Square Meter/Square Meters per Year No MOQ |
Packaging & Delivery | 1.Inner: Vacuum packing or Anti-static package; 2.Outer: Standard export carton; 3.Customized package. Wireless ECG Electrodes PCB PCBA Assembly Manufacturer |
Q1. What service can you supply?