Products

Waterproof and Dustproof Glue Is Used for Potting Epoxy Resin of Electronic Components

China Waterproof and Dustproof Glue Is Used for Potting Epoxy Resin of Electronic Components, Find details about China Adhesive, Waterproof from Waterproof and Dustproof Glue Is Used for Potting Epoxy Resin of Electronic Components

Model NO.
YH-AB
Certification
ISO14001, CCC, RoHS, ISO9001
Formation Mechanism
Conversion Type
Application
Electronic Packaging
Another Name
Epoxy Adhesive
Advantage
Good Fluidity, High Hardness, No Bubbles
Package
Bottle
MOQ
15kg
Viscosity
5000cps
Type
Two Component
Classification
Double Components Adhesives
Usage
Electronic Transformers, Circuit Boards, High-Volt
Keywords
Epoxy Resin Liquid
Material
Pure Epoxy
Certificate
SGS
Trademark
Boqiao
Transport Package
Bottle
Origin
China
HS Code
3506912000
Model NO.
YH-AB
Certification
ISO14001, CCC, RoHS, ISO9001
Formation Mechanism
Conversion Type
Application
Electronic Packaging
Another Name
Epoxy Adhesive
Advantage
Good Fluidity, High Hardness, No Bubbles
Package
Bottle
MOQ
15kg
Viscosity
5000cps
Type
Two Component
Classification
Double Components Adhesives
Usage
Electronic Transformers, Circuit Boards, High-Volt
Keywords
Epoxy Resin Liquid
Material
Pure Epoxy
Certificate
SGS
Trademark
Boqiao
Transport Package
Bottle
Origin
China
HS Code
3506912000
 
Packaging & Delivery
Port
Guangzhou
Lead Time:
Quantity(Kilograms)1 - 10000>10000
Est. Time(days)15To be negotiated
 
Performance before curing
ProjectUnitParameter valueDetection method
ExteriorA component---------Black liquidVisually
B component---------Brown liquidVisually
ViscosityA component25ºC Pa.s8500-9500--------------
B component25ºC Pa.s250-350--------------
ProportionA component25ºC g/cm31.50--------------
B component25ºC g/cm31.50--------------
The mixing ratioProportion(A:B)100:20--------------
 
Performance after curing
ProjectUnitParameter valueDetection method
HardnessSHORE  D80±3---------------
Volume resistance25ºC Ohm-cm1.35*1015---------------
Surface resistance25ºC Ohm1.2*1014---------------
Withstand voltage25ºC KV/MM16-18---------------
Dielectric constant1KHZ3.8-4.2---------------
Waterproof and Dustproof Glue Is Used for Potting Epoxy Resin of Electronic Components
 
 
About potting

When using, please check the A and B agents to observe whether there is sedimentation, and fully stir the A and B agents evenly, take the amount according to the proportion, and the weighing is accurate, please remember that the proportion is the weight ratio rather than the volume ratio. After mixing the A and B agents, stir thoroughly to avoid incomplete curing.
Waterproof and Dustproof Glue Is Used for Potting Epoxy Resin of Electronic ComponentsWaterproof and Dustproof Glue Is Used for Potting Epoxy Resin of Electronic Components
 
APPLICATION

Waterproof and Dustproof Glue Is Used for Potting Epoxy Resin of Electronic Components
Waterproof and Dustproof Glue Is Used for Potting Epoxy Resin of Electronic Components
    Packing

Waterproof and Dustproof Glue Is Used for Potting Epoxy Resin of Electronic Components
Waterproof and Dustproof Glue Is Used for Potting Epoxy Resin of Electronic Components
Waterproof and Dustproof Glue Is Used for Potting Epoxy Resin of Electronic Components
Waterproof and Dustproof Glue Is Used for Potting Epoxy Resin of Electronic ComponentsWaterproof and Dustproof Glue Is Used for Potting Epoxy Resin of Electronic Components
Other product
 
Waterproof and Dustproof Glue Is Used for Potting Epoxy Resin of Electronic Components

Waterproof and Dustproof Glue Is Used for Potting Epoxy Resin of Electronic Components



 

You Might Also Like