Products

Peek Ceramic Test Connector Ufs BGA95 for Smart Phone/Tablet PC/Wearable Devices/TV Board

China Peek Ceramic Test Connector Ufs BGA95 for Smart Phone/Tablet PC/Wearable Devices/TV Board, Find details about China Ufs Socket, Emmc Socket from Peek Ceramic Test Connector Ufs BGA95 for Smart Phone/Tablet PC/Wearable Devices/TV Board

Model NO.
702-0000266
Character
Environmental Protection
Production Process
CNC
Interface Type
No
Brand
Sireda
Pin Count
95
Pitch
0.65mm
Contact
Pogo Pin
Package
BGA
IC Size
11.5X13mm
Payment Term
EXW
Transportation
FedEx/UPS/DHL Acceptable
Material Socket Body
Peek Ceramic
Spring Force
20g~30g Per Pin
MOQ
No MOQ Limitation
Operation Temperature
-40 ~ 140 ºC
Life Span
50K Cycles
Trademark
Sireda
Transport Package
Carton
Specification
BGA95
Origin
Shenzhen, China
HS Code
8536690000
Model NO.
702-0000266
Character
Environmental Protection
Production Process
CNC
Interface Type
No
Brand
Sireda
Pin Count
95
Pitch
0.65mm
Contact
Pogo Pin
Package
BGA
IC Size
11.5X13mm
Payment Term
EXW
Transportation
FedEx/UPS/DHL Acceptable
Material Socket Body
Peek Ceramic
Spring Force
20g~30g Per Pin
MOQ
No MOQ Limitation
Operation Temperature
-40 ~ 140 ºC
Life Span
50K Cycles
Trademark
Sireda
Transport Package
Carton
Specification
BGA95
Origin
Shenzhen, China
HS Code
8536690000
Product Description

F Interposer Characteristics 

Usually, there will be some residual solder with the pads on customer's main board or test board when a DUT IC chip is removed from the PCB board. This leads to problems of bad pads co-planarity, oxidation, so as to poor contact or even damages of PCB board when testing using a socket directly connecting to the PCB board.
 
Sireda's patented F Solution with F Interposer helps to fix the problem. F Interposer, as a bridge, which connects customer main board to Sireda test socket, brings customer big convenience and cost saving as well. For different applications of the same device (like eMMC 153), customer only needs to change a new interposer and take use of the same socket for test.
Peek Ceramic Test Connector Ufs BGA95 for Smart Phone/Tablet PC/Wearable Devices/TV Board
Peek Ceramic Test Connector Ufs BGA95 for Smart Phone/Tablet PC/Wearable Devices/TV Board

BGA95 UFS Test Socket with F interposer
 

 •  F Solution is designed for fast validation & test of IC chip like eMMC, DRAM, eMCP, UFS, FLASH, LPDDR3, LPDD4, and CPU as well.

 •  Patented Interposer design avoid problems of pad co-planarity oxidation and damage of PCB board after de-soldering.

 •  The compact, surface mount design requires no tooling, no extra place or mounting holes in the target PC board, maximizing real estate while reducing board cost.

 •  "Buy and use" design and with fully removable double latch turning lid bring customers big convenience.

 •  Precision machined spring probes with industry proven solder balls ensure high reliability performance, easy maintenance.

 •  Customized interposer development.

 •  The F1 interposer is with some pinout based on F interposer, providing signal access to the clock, strobe, data, address and command signals to the BGA package for making electrical and timing measurements with an oscilloscope. For more details, please refer to our F1 solution.
 

Product Parameters
Mechanical
Material Socket BodyPeek Ceramic
Material Socket Lid AL, Cu, POM
ContactPogo Pin
Operation Temperature-40 ~ 140 ºC
Life Span50K Cycles
Spring Force20g ~ 30g per Pin
Electrical
Current Rating1.0 ~ 2.0A
DC ResistanceMax. 100mΩ
 
Application Example

Solder the Interposer onto mainboard,screw socket to the interposer, and insert the device to be tested, place and lock the lid, then screw down the heat sink actuator for device engagement. Now it is ready for use.

Advantages with F solution are convenience,high efficiency,compact structure,cost-effective, is called kind of "buy and use" modular.

Main applications are for test, debug & validation of devices of BGA, LGA, QFP, QFN, SOP used on smart phone, tablet PC, wearable devices, TV board, etc.

A lot of F solutions have been provided to our customers for their memory IC chips like eMMC, eMCP, FLASH, DDR, UFS and CPU devices as well.
Peek Ceramic Test Connector Ufs BGA95 for Smart Phone/Tablet PC/Wearable Devices/TV Board

Relative Products
Here it only shows a selection of sockets, for customized or other type, please have look at our website: siredatech.en.made-in-china.com.
Part NumberNameDescriptionPackage
702-0000159F SolutionBGA153 0.5mm eMMC DT100 11.5x13mm F A BGA153
702-0000175F SolutionBGA221 0.5mm eMCP DT100 11.5x13mm F A BGA221
702-0000176F SolutionBGA63 0.8mm DT100 9x11mm F A BGA63
702-0000177F SolutionBGA168 0.5mm LPDDR DT100 12x12mm F A BGA168
702-0000181F SolutionBGA78 0.8mm DDR DT100 10.5x12mm F A BGA78
702-0000185F SolutionBGA96 0.8mm DDR DT100 9x14mm F A BGA96
702-0000186F SolutionBGA96 0.8mm DDR DT100 9x13mm F A BGA96
702-0000187F SolutionBGA78 0.8mm DDR DT100 9x10.5mm F A BGA78
702-0000188F SolutionBGA78 0.8mm DDR DT100 9x11.1mm F A BGA78
702-0000189F SolutionBGA84 0.8mm DDR DT100 8x12.5mm F A BGA84
702-0000203F SolutionBGA153 0.5mm eMMC DT100 10x11mm F A BGA153
702-0000204F SolutionBGA169 0.5mm eMMC DT100 12x16mm F A BGA169
702-0000205F SolutionBGA169 0.5mm eMMC DT100 12x18mm F A BGA169
702-0000206F SolutionBGA169 0.5mm eMMC DT100 14x18mm F A BGA169
702-0000207F SolutionBGA162 0.5mm eMCP DT100 11.5x13mm F A BGA162
702-0000210F SolutionBGA216 0.4mm  DT100 12x12mm F A BGA216
702-0000211F SolutionBGA134 0.65mm  DT100 10x11.5mm F A BGA134
702-0000212F SolutionBGA107 0.8mm  DT100 10.47x12.99mm F A BGA107
702-0000213F SolutionBGA107 0.8mm  DT100 11.5x13mm F A BGA107
702-0000215F SolutionBGA63 0.8mm  DT100 9.5x12mm F A BGA63
702-0000216F SolutionBGA96 0.8mm DDR DT100 10x14mm F A BGA96
702-0000217F SolutionBGA130 0.65mm MCP DT100 8x9mm F A BGA130
702-0000218F SolutionBGA100 1.0mm Nand DT100 14x18mm F A BGA100
702-0000219F SolutionBGA152 1.0mm Nand DT100 14x18mm F A BGA152
702-0000220F SolutionBGA132 1.0mm Nand DT100 12x18mm F A BGA132
702-0000221F SolutionBGA136 1.0mm Nand DT100 14x16.5mm F A BGA136
702-0000225F SolutionLGA60 1.41mm Nand DT100 11x14mm F A LGA60
702-0000226F SolutionLGA60 1.41mm Nand DT100 12x17mm F A LGA60
702-0000227F SolutionLGA52 1.41mm Nand DT200 12x20mm F A LGA52
702-0000229F SolutionLGA60 1.41mm Nand DT100 13x18mm F A LGA60
702-0000230F SolutionLGA52 1.41mm Nand DT100 14x18mm F A LGA52
702-0000233F SolutionBGA96 0.8mm DDR DT100 9x13mm F A BGA96
702-0000240F SolutionBGA78 0.8mm DDR DT100 7.5x11mm F A BGA78
702-0000244F SolutionBGA78 0.8mm DDR DT100 8x10.5mm F A BGA78
702-0000249F SolutionBGA78 0.8mm DDR DT100 9x10.6mm F A BGA78
702-0000251F SolutionBGA78 0.8mm DDR DT100 9x11.5mm F A BGA78
702-0000255F SolutionBGA78 0.8mm DDR DT100 9.4x11.1mm F A BGA78
702-0000258F SolutionBGA78 0.8mm DDR DT100 10x11mm F A BGA78
702-0000262F SolutionBGA144 0.8mm DRAM DT100 11x18.5mm F A BGA144
702-0000266F SolutionBGA95 0.65mm UFS DT100 11.5x13mm F A BGA95
702-0000267F SolutionBGA96 0.8mm DDR DT100 7.5x13mm F A BGA96
702-0000268F SolutionBGA96 0.8mm DDR DT100 7.5x13.3mm F A BGA96
702-0000277F SolutionBGA96 0.8mm DDR DT100 9.4x13mm F A BGA96
702-0000278F SolutionBGA96 0.8mm DDR DT100 10x13.3mm F A BGA96
702-0000280F SolutionBGA96 0.8mm DDR DT100 11x13.3mm F A BGA96
702-0000281F SolutionBGA170 0.8mm DDR DT100 12x14mm F A BGA170
702-0000282F SolutionBGA136 0.8mmDDR DT100 10x14mm F A BGA136
702-0000283F SolutionBGA136 0.8mmDDR DT100 11x14mm F A BGA136
702-0000284F SolutionBGA136 0.8mmDDR DT100 12x14mm F A BGA136
702-0000285F SolutionBGA137 0.8mm MCP DT100 10.5x13mm F A BGA137
702-0000286F SolutionBGA137 0.8mm MCP DT100 11.5x13mm F A BGA137
702-0000295F SolutionBGA88 0.8mm DT100 8x10mm F A BGA88
702-0000297F SolutionBGA88 0.8mm DT100 11x11mm F A BGA88
702-0000298F SolutionBGA88 0.8mm DT100 8x11.6mm F A BGA88
702-0000325F SolutionBGA136 0.8mm eMCP DT100 10.5x13mm F A BGA136
702-0000418F SolutionBGA178 0.65mm LPDDR DT100 11x11.5mm F A BGA178
702-0000627F SolutionTSOP48 0.5mm Nand DT100 12x20mm F A TSOP48
702-0000666F SolutionQFP256 0.4mm DT125 28x28mm F A QFP256
702-0000667F SolutionQFP176 0.4mm DT100 20x20mm F A QFP176
702-0000671F SolutionQFN88 0.5mm BF504F CS 12x12mmQFN88
702-0000725F SolutionBGA96 0.8mm DDR DT100 7.5x13.5mm F A BGA96
702-0000743F SolutionLGA118 2.0mm RF module CT 27.2x25.2mmLGA118
702-0000842F SolutionBGA168 0.5mm LPDDR DT100 12x12mm F A BGA168
702-0000945F SolutionBGA169 0.5mm eMMC DT100 12x16mm F A BGA169
702-0000949F SolutionBGA132 1.0mm Nand DT100 12x18mm F A BGA132
702-0001074F SolutionBGA100 1.0mm eMMC DT100 14x18mm F A NBBGA100
702-0001075F SolutionBGA100 1.0mm eMMC DT100 14x18mm F A BABGA100
702-0001076F SolutionBGA78 0.8mm DDR DT100 8x12mm F A BGA78
702-0001149F SolutionBGA254 0.5mm eMCP DT100 11.5x13mm F A BGA254
702-0000624F1 SolutionBGA153 0.5mm eMMC DT100 11.5x13mm F1 A BGA153
702-0000723F1 SolutionBGA162 0.5mm eMCP DT100 11.5x13mm F1 A BGA162
702-0000791F1 SolutionBGA221 0.5mm eMCP DT100 11.5x13mm F1 A BGA221
702-0000953F1 SolutionBGA153 0.5mm UFS DT-mini 11.5x13mm F1BGA153
702-0001026F1 SolutionBGA254 0.5mm eMCP DT100 11.5x13mm F1 BGA254
702-0001085F1 SolutionBGA100 1.0mm eMMC DT100 14x18mm F1 A BGA100
 
Company Profile

Peek Ceramic Test Connector Ufs BGA95 for Smart Phone/Tablet PC/Wearable Devices/TV BoardSireda Technology Co.,Ltd established in Shenzhen, China in 2010, focused on semiconductor test & rework solutions.

Our products include : Standard test solution, standard test socket &jigs, customized sockets, Jig& Automation, FA support, Rework solutions, rework services.

Be the world's leading socket supplier
As an IC testing socket supplier, we focus on Semiconductor Testing Research and Innovations, has Achieved a lot of Patents. And also get the certificate of National High-tech.


Create value for our customers
We are committed to provide the most competitive price, highest quality, best custom design, shortest lead time, and most professional service for our customer all over the world. Work closely with customer and enable them to achieve greater manufacturing efficiency and productivity.
 
Certifications

Quality Management System-ISO 9001:2015, National High Technology Expertise, US Patent, Industrial Design, Patent for Utility Model etc.
Peek Ceramic Test Connector Ufs BGA95 for Smart Phone/Tablet PC/Wearable Devices/TV Board

Sireda has been authorized as National High Technology Expertise.

Sireda Technology Co., Ltd focuse on semiconductor test & rework solutions. Since established in 2010, we keep developing technology in IC test device, ATE test solution and provide fast & good test solution to customers worldwide.

Sireda is highly recognized by industry professionals as a company with growth potential.
 
Our Advantages
No MOQNo MOQ limitation here.
Our cooperation can begin with the sample and provide quality assurance to you before mass production.
High Cost PerformanceWe provide products with high quality and competitive price.
Technical SupportWe have a professional R & D team and all the engineers have more than 5 years' experience.
So we have the ability to design and produce best products according to our customers' requirements.
Best ServiceWe provide inquiry and consulting & technical support for both pre-sale and after sale.
Strictly quality control is in each production process.
Our team are keep helping our customers to solve their problems anytime if needed.
 
Our Exhibition and Customers

Peek Ceramic Test Connector Ufs BGA95 for Smart Phone/Tablet PC/Wearable Devices/TV Board


 

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