China Shenzhen Factory for Electronic Contract Manufacturing PCBA Box Build One Stop Service, Find details about China Contract Manufacturing, Box Build from Shenzhen Factory for Electronic Contract Manufacturing PCBA Box Build One Stop Service
Production Ability For PCB | |
Layer: | 1-40 layer |
Surface: | HASL/OSP/ENIG/ImmersionGold/Flash Gold/Gold finger ect. |
Copper thickness: | 0.25 Oz -12 Oz |
Material: | FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum BT,Rogers |
Board thickness | 0.1 to 6.0mm(4 to 240mil) |
Minimum line width/space | 0.076/0.076mm |
Minimum line gap | +/-10% |
Outer layer copper thickness | 140um(bulk) 210um(pcb prototype) |
Inner layer copper thickness | 70um(bulk) 150um(pcb protytype) |
Min.finished hole size(Mechanical) | 0.15mm |
Min.finished hole size (laser hole) | 0.1mm |
Aspect ratio | 10:01(bulk) 13:01(pcb prototype) |
Solder Mask Color | Green,Blue,Black,White,Yellow,Red,Grey |
Tolerance of dimension size | +/-0.1mm |
Tolerance of board thickness | <1.0mm +/-0.1mm |
Tolerance of finished NPTH hole size | +/-0.05mm |
Tolerance of finished PTH hole size | +/-0.076mm |
Delivery time | Mass:10~12d/ Sample:5~7D |
Capacity | 35000sq/m |
Production Ability For PCB Assembly | |
Stencil Size: | 640x640mm |
Minimum IC Pitch: | 0.2mm |
Minimum chip size: | 0201 (0.2x0.1) |
Min. space of BGA: | 0.3mm |
Max.precision of IC assembly: | ±0.03mm |
SMT capacity: | ≥2 million points/day |
DIP capacity: | ≥100k parts/day |
electronic product final assembly: | electronic product final assembly: |
Certification: | ISO9001:2015, ISO13485:2016, IAFT16949:2016 |