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Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA

China Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA, Find details about China Multilayer Printed Circuit Board, 6 Layer PCB Board from Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA

Model NO.
OKey-am-ooo5
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Organic Resin
Surface Treatment
Immersion Gold
Solder Mask Color
Green
Trademark
OKEY
Transport Package
Inner Vacuum Bubble Bag Packing, Outer Carton Box
Specification
Rohs, UL, IS001: 2008
Origin
Shenzhen Guangdong China
Model NO.
OKey-am-ooo5
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Organic Resin
Surface Treatment
Immersion Gold
Solder Mask Color
Green
Trademark
OKEY
Transport Package
Inner Vacuum Bubble Bag Packing, Outer Carton Box
Specification
Rohs, UL, IS001: 2008
Origin
Shenzhen Guangdong China
Technical Capabilities
ItemsSpeci.Remark
Max panel size32" x 20.5"(800mm x 520mm) 
Max. Board size2000×610mm 


Min. board Thickness		2-layer 0.15mm 
4-layer 0.4mm 
6-layer 0.6mm 
8-layer 1.5mm 
10-layer 1.6~2.0mm 
Min. line Width/Space0.1mm(4mil) 
Max. Copper thickness10OZ 
Min. S/M Pitch0.1mm(4mil) 
Min. hole size0.2mm(8mil) 
Hole dia. Tolerance (PTH)±0.05mm(2mil) 
Hole dia. Tolerance,+0/-0.05mm(2mil) 
Hole position deviation±0.05mm(2mil) 
Outline tolerance±0.10mm(4mil) 
Twist & Bent0.75% 
Insulation Resistance>10 12 Ω Normal 
Electric strength>1.3kv/mm 
S/M abrasion>6H 
Thermal stress288°C 10Sec 
Test Voltage50-300V 
Min. blind/buried via0.15mm (6mil) 

Surface Finished		HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold 

Materials		FR4,H-
TG,Teflon,Rogers,Ceramics,Aluminium, Copper base		 
Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm) 
Min PAD (inner layer)5 mil(0.13mm)hole ring width
Min thickness(inner layer)4 mil(0.1mm)without copper
Inner copper thickness1~4 oz 
Outer copper thickness0.5~6 oz 
Finished board thickness0.4-3.2 mm 

Board thickness tolerance control		±0.10 mm±0.10 mm
1~4 L
±10%±10%6~8 L
±10%±10%≥10 L
Inner layer treatmentbrown oxidation 
Layer count Capability1-30 LAYER 
alignment between ML±2mil 
Min drilling0.15 mm 
Min finished hole0.1 mm 


Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA
Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA
Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA
Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA
Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA
Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA
Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA
Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA
Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA
Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA
Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA
Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA
 

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