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Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA

China Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA, Find details about China PCB, PCB Board from Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA

Model NO.
OKey-am-0031
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Organic Resin
Sales Service
24 Hours Online Service
Order Acceptable
Sample Order and Small Order
Engineer Service
Copy PCB Gerber File
Product Characteristics
Red Mask for Double Sides
Certificates
UL, RoHS, SGS, ISO9001
Trademark
OKEY
Transport Package
Inner Vacuum Packed Outside in Carton
Specification
UL, Rohs, ISO9001: 2008
Origin
Shenzhen City, China
HS Code
8534009000
Model NO.
OKey-am-0031
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Organic Resin
Sales Service
24 Hours Online Service
Order Acceptable
Sample Order and Small Order
Engineer Service
Copy PCB Gerber File
Product Characteristics
Red Mask for Double Sides
Certificates
UL, RoHS, SGS, ISO9001
Trademark
OKEY
Transport Package
Inner Vacuum Packed Outside in Carton
Specification
UL, Rohs, ISO9001: 2008
Origin
Shenzhen City, China
HS Code
8534009000
Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA
Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA
Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA
Professional High Quality for Turn-Key PCB Assembly of SMT and PCBAProfessional High Quality for Turn-Key PCB Assembly of SMT and PCBA
Technical Capabilities
ItemsSpeci.Remark
Max panel size32" x 20.5"(800mm x 520mm) 
Max. Board size2000×610mm 


Min. board Thickness		2-layer 0.15mm 
4-layer 0.4mm 
6-layer 0.6mm 
8-layer 1.5mm 
10-layer 1.6~2.0mm 
Min. line Width/Space0.1mm(4mil) 
Max. Copper thickness10OZ 
Min. S/M Pitch0.1mm(4mil) 
Min. hole size0.2mm(8mil) 
Hole dia. Tolerance (PTH)±0.05mm(2mil) 
Hole dia. Tolerance,+0/-0.05mm(2mil) 
Hole position deviation±0.05mm(2mil) 
Outline tolerance±0.10mm(4mil) 
Twist & Bent0.75% 
Insulation Resistance>10 12 Ω Normal 
Electric strength>1.3kv/mm 
S/M abrasion>6H 
Thermal stress288°C 10Sec 
Test Voltage50-300V 
Min. blind/buried via0.15mm (6mil) 

Surface Finished		HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold 

Materials		FR4,H-
TG,Teflon,Rogers,Ceramics,Aluminium, Copper base		 
Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm) 
Min PAD (inner layer)5 mil(0.13mm)hole ring width
Min thickness(inner layer)4 mil(0.1mm)without copper
Inner copper thickness1~4 oz 
Outer copper thickness0.5~6 oz 
Finished board thickness0.4-3.2 mm 

Board thickness tolerance control		±0.10 mm±0.10 mm
1~4 L
±10%±10%6~8 L
±10%±10%≥10 L
Inner layer treatmentbrown oxidation 
Layer count Capability1-30 LAYER 
alignment between ML±2mil 
Min drilling0.15 mm 
Min finished hole0.1 mm 

Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA
Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA
Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA
Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA
Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA
Professional High Quality for Turn-Key PCB Assembly of SMT and PCBA


Good quality printed circuit board

High quality immersion gold pcb board:
1. We have 10 years experience in Printed Circuit Board field to serve your needs
2. Competitive price with high quality service-24 hours online service
3. Prompt delivery reable factory
4. Our Printed Circuit Board get ISO and UL Certificates and meet ROHS standard
NO
 		ITEM
 		Technical capabilities
 
1
 		Layers
 		1-20 layers
 
2
 		Max. Board size
 		2000×610mm
 
3
 		Min. board Thickness
 		2-layer  0.25mm
 
4-layer  0.6mm
 
6-layer  0.8mm
 
8-layer  1.5mm
 
10-layer  1.6~2.0mm
 
4
 		Min. line Width/Space
 		0.1mm(4mil)
 
5
 		Max. Copper thickness
 		10OZ
 
6
 		Min. S/M Pitch
 		0.15mm(4mil)
 
7
 		Min. hole size
 		0.2mm(8mil)
 
8
 		Hole dia. Tolerance (PTH)
 		±0.05mm(2mil)
 
9
 		Hole dia. Tolerance (NPTH)
 		+0/-0.05mm(2mil)
 
10
 		Hole position deviation
 		±0.05mm(2mil)
 
11
 		Outline tolerance
 		±0.10mm(4mil)
 
12
 		Twist & Bent
 		0.75%
 
13
 		Insulation Resistance
 		>10 12 Ω Normal
 
14
 		Electric strength
 		>1.3kv/mm
 
15
 		S/M abrasion
 		>6H
 
16
 		Thermal stress
 		288°C 10Sec
 
17
 		Test Voltage
 		50-300V
 
18
 		Min. blind/buried via
 		0.15mm  (6mil)
 
19
 		Surface Finished
 		HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
 
20
 		Materials
 		FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base
 

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