Rigid-Flex Printed Circuit Board with Flexible PCBA Manufacturing

China Rigid-Flex Printed Circuit Board with Flexible PCBA Manufacturing, Find details about China PCB Sample, PCB from Rigid-Flex Printed Circuit Board with Flexible PCBA Manufacturing

Basic Info.

Model NO.

PCB

Processing Technology

Electrolytic Foil

Base Material

Fr4+Pi

Insulation Materials

Organic Resin

Brand

Board Material

Fr4+Pi

Board Thickness

1.6mm

Copper Thickness

1oz

Surface Treatment

Immersion Gold

Product Name

PCB Manufacturer Immersion Gold 8L Rigid Flex PCB

Package

Carton + Vacuum

Small Order

1 PCS

Trademark

Fastline

Transport Package

Vacuum+Carton Packing

Specification

UL, SGS, ROHS

Origin

China

HS Code

853400900

Model NO.

PCB

Processing Technology

Electrolytic Foil

Base Material

Fr4+Pi

Insulation Materials

Organic Resin

Brand

Board Material

Fr4+Pi

Board Thickness

1.6mm

Copper Thickness

1oz

Surface Treatment

Immersion Gold

Product Name

PCB Manufacturer Immersion Gold 8L Rigid Flex PCB

Package

Carton + Vacuum

Small Order

1 PCS

Trademark

Fastline

Transport Package

Vacuum+Carton Packing

Specification

UL, SGS, ROHS

Origin

China

HS Code

853400900

Product Desciption

Rigid-flex printed circuit board with flexible pcba manufacturing

Hi buyer,

Thank your for scanning our Rigid-Flex PCB Products.

As is known,PCB is customized product ,so the unit price is not real,details pls contact me and a quotation will be offered.Please send us PCB files in gerber files, ".pcbdoc", ".lay", ".lay6" or ".brd" .

Product Description

Standard Flex Materials:

Polyimide (Kapton) 0.5 mil to 5 mils (.012mm - .127mm)
Adhesiveless Copper Clad Base Material 1 mil to 5 mils

Flame Retardant Laminate, Base Material, and Coverlay
High Performance Epoxy Laminate and Prepreg
High Performance Polyimide Laminate and Prepreg
UL and RoHS Compliant Material on request
High Tg FR4 (170+ Tg), Polyimide (260+ Tg)

Base Copper:
1/3 oz. - .00047 in. (.012mm)--rarely used
1/2 oz. - .0007 in. (.018mm)
1 oz. - .0014 in. (.036mm)
2 oz. - .0028 in. (.071mm)

Solder Mask:
Polyimide Coverlay: 0.5 mil to 5 mils Kapton (.012mm - .127mm)
with 0.5 to 2 mil Adhesive (.012mm - .051mm)
LPI and LDI Flexible Soldermasks

Rigid-Flex PCB Capability

Fastline FPC board and Rigid-flex PCB capability
Technology and Capabilities
Material	Polyimide / Polyester
Counts	Flex: 1~8L; Rigid-Flex: 2~8L
Board Thickness	Min.0.05mm ; Max. 0.3mm
Copper Thickness	1/3 oz --- 2 oz
Maximum dimensions	For FPC:250mm1200mm(normal); 250mm100,000mm
CNC Drill Size (Max)	6.5mm
CNC Drill Size (Min)	Flex: 0.15mm
Holes Location Tolerance	±0.05mm
Coverlay Drill Size (Min)	0.6mm
Hole to Coverlay Opening Windows (Min)	0.15mm
Min Line Width / Spacing	0.1/0.1mm
Aspect Ratio	61
Copper Thickness on Hole Wall	Flex:12-22μm
Min Pad Size	φ0.2mm
Etch Tolerance	Finished line width tolerance ±20%
Pattern Registration Tolerance	±0.1mm (Working Panel Size: 250*300mm)
Coverlay Registration Tolerance	±0.15mm
Solder Mask Registration Tolerance	±0.2mm
Solder Mask to PAD	Non photosensitive: 0.2mm Photosensitive: 0.1mm
Min. Solder Mask Dam	0.1mm
Misregistration Tolerance for Stiffener, Adhesive, Glue paper	±0.30mm
Surface Finish	Plating Ni / Au ; Chemical Ni / Au ; OSP