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Printed Circuit Board Copper Plating Tetrahydroxypropylethylendiamine Q75

China Printed Circuit Board Copper Plating Tetrahydroxypropylethylendiamine Q75, Find details about China Zinc-Nickel Alloy Chemicals, Tetrahydroxypropyl Ethylenediamine from Printed Circuit Board Copper Plating Tetrahydroxypropylethylendiamine Q75

Model NO.
GL-Q75
CAS No.
102-60-3
Formula
C14h32n2o4
EINECS
203-041-4
Status
Liquid Catalyst
Response Type
Polymerization
Classification
Homogeneous Catalysts
Effect Size
Tetrahydroxypropyl Ethylenediamine
Application Industry
Industry
Trademark
GLORY
Transport Package
200kg/Drum
Specification
99%
Origin
China

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