China Fast Curing Repair Material Is Used for Electronic Component Ceramic Bonding Silicone Resin, Find details about China Adhesive, Epoxy Resin from Fast Curing Repair Material Is Used for Electronic Component Ceramic Bonding Silicone Resin
Quantity(Kilograms) | 1 - 10000 | >10000 |
Est. Time(days) | 15 | To be negotiated |
project | unit | Parameter value |
Bending failure load | N | 95 |
Bending strength | Mpa | 32.7 |
Tensile failure load | N | 510 |
Tensile Strength | Mpa | 11.6 |
project | unit | Parameter value | Detection method |
Roll out | -------- | black | ------- |
Chroma | Gardner | <3 | ------- |
Amine value | Acid-base titration | 310 | ------- |
Viscosity | cps/25ºC | 8000-12000 | ------- |
proportion | 25ºC | 1.21 | ------- |
100 grams of resin added | PHR | 100 | ------- |
APPLICATION |
Packing |