Dongguan Custom Electronic Printed Circuit Board SMT, DIP, Assembly PCBA Board Manufacturer

China Dongguan Custom Electronic Printed Circuit Board SMT, DIP, Assembly PCBA Board Manufacturer, Find details about China Circuit Board, Circuit Board Assembly from Dongguan Custom Electronic Printed Circuit Board SMT, DIP, Assembly PCBA Board Manufacturer

Basic Info.

Processing Technology

Electrolytic Foil

Base Material

Aluminum

Insulation Materials

Epoxy Resin

Brand

OEM

Copper Thickness

1/2oz 1oz 2oz 3oz

Board Thickness

1.6mm

Min. Hole Size

0.25mm

Min. Line Width

0.075mm

Surface Finishing

HASL/OSP/Enig

Trademark

OEM

Transport Package

Carton

Specification

10 X 10 CM

Origin

China

Processing Technology

Electrolytic Foil

Base Material

Aluminum

Insulation Materials

Epoxy Resin

Brand

OEM

Copper Thickness

1/2oz 1oz 2oz 3oz

Board Thickness

1.6mm

Min. Hole Size

0.25mm

Min. Line Width

0.075mm

Surface Finishing

HASL/OSP/Enig

Trademark

OEM

Transport Package

Carton

Specification

10 X 10 CM

Origin

China

Product Desciption

DongGuan Custom Electronic Printed Circuit Board SMT, DIP, Assembly PCBA Board Manufacturer

As below specification for reference:

Item	Process Capability
Layer Counts	1-24L
Material	FR-4, Ceramic, Alu Base ,Cu base. Rogers etc
Maximum Size	600mm X 1500mm
Board Outline Tolerance	±0.10mm
Board Thickness	0.20mm--8.00mm
Thickness Tolerance( t≥0.8mm)	±8%
Thickness Tolerance( t<0.8mm)	±10%
Insulation Layer Thickness	0.075mm--5.00mm
Minimum Line	0.075mm
Minimum Space	0.075mm
Out Layer Copper Thickness	18um--350um
Inner Layer Copper Thickness	17um--210um
Drilling Hole (Mechanical)	0.15mm--6.35mm
Finish Hole (Mechanical)	0.10mm--6.30mm
Diameter Tolerance (Mechanical)	0.05mm
Registration (Mechanical)	0.075mm
Aspect Ratio	16:1
Solder Mask Type	LPI
SMT Mini. Solder Mask Width	0.075mm
Mini. Solder Mask Clearance	0.05mm
Plug Hole Diameter	0.25mm--0.60mm
Impedance Control Tolerance	±10%
Surface Finish	HASL,ENIG,Chem. Tin,Chem Silver. Flash Gold,OSP,Gold finger

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