USA Bergquist Thermal Gap Pad with 0.8W/M. K

China USA Bergquist Thermal Gap Pad with 0.8W/M. K, Find details about China Soft Thermal Gap Pad, Thermal Conductive Gap Pad Coated Fiberglass from USA Bergquist Thermal Gap Pad with 0.8W/M. K

Model NO.
PM200S
Classification
Organic Insulating Material
Certification
UL
Color
Hoar + Pink
Brand
Jrft
Thickness
0.5~10mm
Thickness Tolerance
0.16+-0.01 Mm
Hardness
30+-5 Shore a
Specific Gravity
2.6
Continuous Use Temp
-60+200 Deg
Themal Conductivity
0.8 W/M.K
Size
Customize
Trademark
OEM, ODM
Specification
UL, SGS
Origin
USA
Model NO.
PM200S
Classification
Organic Insulating Material
Certification
UL
Color
Hoar + Pink
Brand
Jrft
Thickness
0.5~10mm
Thickness Tolerance
0.16+-0.01 Mm
Hardness
30+-5 Shore a
Specific Gravity
2.6
Continuous Use Temp
-60+200 Deg
Themal Conductivity
0.8 W/M.K
Size
Customize
Trademark
OEM, ODM
Specification
UL, SGS
Origin
USA

Bergquist  Thermal Gap Pad
Features and Benefits
Thermal conductivity: 0.8 W/m-K
Conformable, low hardness
Enhanced puncture, shear and tear resistance
Electrically isolating
Gap Pad VO Soft is recommended for applications that require a minimum amount of pressure on components. Gap Pad VO Soft is a highly conformable, low modulus, filled-silicone polymer on a rubber-coated fiberglass carrier. The material can be used as an interface where one side is in contact with a leaded device.

Note: Resultant thickness is defined as the final gap thickness of the application.
 
Typical Applications Include
Telecommunications
Computer and peripherals
Power conversion
Between heat-generating semiconductors or magnetic components and a heat sink
Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader