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High Quality Multilayer PCB Assembly/PCB Manufacturer in China

High Quality Multilayer PCB Assembly/PCB Manufacturer in China, Find details about China High Quality PCB Circuit, PCB Circuit Wth Blind Vias from High Quality Multilayer PCB Assembly/PCB Manufacturer in China

Model NO.
P6150
Condition
New
Max Layers
24 Layers
Min Hole
0.005mm
Surface
Enig,HASL,Pb HASL,Hard Gold ,etc
Material
Fr4,Rogers,Ceramics,Aluminum
Files Needed
Gerbers,Boms
MOQ
1PC
Prototype Lead Time
3-7days
Mass Lead Time
7-15days
OEM&ODM
Acceptable
Trademark
Suntek
Transport Package
by ESD Pacakge
Specification
110*65mm
Origin
China
HS Code
8573109090
Model NO.
P6150
Condition
New
Max Layers
24 Layers
Min Hole
0.005mm
Surface
Enig,HASL,Pb HASL,Hard Gold ,etc
Material
Fr4,Rogers,Ceramics,Aluminum
Files Needed
Gerbers,Boms
MOQ
1PC
Prototype Lead Time
3-7days
Mass Lead Time
7-15days
OEM&ODM
Acceptable
Trademark
Suntek
Transport Package
by ESD Pacakge
Specification
110*65mm
Origin
China
HS Code
8573109090
Name:PCB fabrication and PCB assembly

Suntek is a professional PCBA solution provider,specilizes in PCB production,components procurement,PCBA assembly and a series service of wire harness and Box building.

We have high-qualified management team, experienced R and D team and skilled employees and possess advantaged supply chain, commitment to quality and dedication to our customers and service.
Welcome to send us Gerber file and BOM list for estimating at any time
You will get our prompt reply in 24H

PCB capabilities:
ItemsParameterSpecial
 Layers Counts2-20 
Board materialFR-4,AluminumHigh Tg  FR4
max Fabrication area580×700mm500mm×3000mm
Board thickness0.1-3.2mm 
CamberDouble Side
multi -layers		d ≤0.075mm
d ≤1%		d≤0.05mm
Impedance±7%±5%
PTH toleranced>5.0±0.076mm 
0.3<d≤5.0±0.05mm 
d≤0.3±0.08mm 
Min finished hole size0.15mm 
Hole copper thickness≥20um 
Min track width, spacing0.05mm ×0.05mm 
Profile size±0.1mm±0.05mm
ProfileRouting,Punch,Cut,V-cut,Chanfer 
Surface finishImmersion Gold:0.025~0.075um 
Gold finger:≥0.13 um≥1.0 um
OSP:0.2-0.5µm 
HAL:5~20 um 
LEADFREE HAL:5~20 um 
Surface platingSolder mask:  Black  Green  White  Red  Thickness≥17 um,Block,BGA
Character : Black  Yellow   Green  White style: Highness≥0.0.625mm    Width≥0.125mm
Ppeelable mask:  red bule thickness≥300 um
Carbonink :  Black  thickness≥25 um  Highness≥0.30mm  Width≥0.3mm


PCBA capabilities:
1) SMT assembly including BGA assembly
2) Accepted SMD chips: 01005, BGA, QFP, QFN, TSOP
3)Component height: 0.2-25mm
4)Min packing: 0201
5) Min distance among BGA: 0.25-2.0mm
6)Min BGA size: 0.1-0.63mm
7)Min QFP space: 0.35mm
8) Min assembly size: (X) 50 * (Y) 30mm
9)Max assembly size: (X): 350 * (Y) 550mm
10) Pick-placement precision: ±0.01mm
11) Placement capability: 0805, 0603, 0402, 0201
12) High-pin count press fit available
13)SMT capacity per day: 800,000 points

Advantages of PCB and PCB assembly:
1) Strict product liability, taking IPC-A-160 standard
2)Engineering pretreatment before production
3) Production process control (5ms)
4) 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
5) 100% AOI inspection, including X-ray, 3D microscope and ICT
6) High-voltage test, impedance control test
7)Microsection, soldering capacity, thermal stress test, shocking test
8)In-house PCB production
9) No minimum order quantity and free sample
10) Focus on low to medium volume production
11)Quick and on-time delivery

High Quality Multilayer PCB Assembly/PCB Manufacturer in China


Our Certifciate:
High Quality Multilayer PCB Assembly/PCB Manufacturer in China

Our Exhibtion:
High Quality Multilayer PCB Assembly/PCB Manufacturer in China

Welcome to send your any request to us!We will reply you in 24hours !
 

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